F2/N2 gas mixture is used to remove unwanted layers of material on the surface of semiconductor chips. In particular, Fluorine (F2) in the mixture helps create extremely small and complex details on the chip.

F2/N2 gas is used to create precise thin layers on the surface of semiconductor chips. This plays an important role in creating smooth and uniform coatings, which are necessary for the production of electronic components and circuits on chips.

Thin Layer Quality: F2/N2 gas is used to control the quality of the thin layers on the chip, ensuring that they have the thickness and uniformity critical to achieving chip performance and reliability.

Environmental Control: Nitrogen (N2) in the mixture plays an important role in controlling the environment in semiconductor chip manufacturing equipment, helping to maintain stability and precision in the manufacturing process.

The F2/N2 gas mixture plays an important role in creating precise and high-performance components on semiconductor chips, while keeping the manufacturing environment controlled and stable.